Indium Corporation Introduces New Cleanable SiPaste(R) For Fine Feature Printing

Indium Corporation has added to its portfolio of pastes for fine feature printing with a halogen-free, cleanable solder paste specifically formulated to accommodate fine feature printing, as seen in the 01005 and 008004 components.

SiPaste C201HF combines superior, industry-leading non-wet open (NWO) performance with excellent stencil print transfer efficiency to satisfy the widest range of process requirements and improve SPI yields. It leaves a clean residue, can be removed with a commercially available semi-aqueous cleaning solution, or it can be used as a standard no-clean paste in processes where post-reflow cleaning is not available.

SiPaste C201HF has excellent transfer efficiency in fine aperture parts, with a consistent process yield of less than 80μm. The SiPaste C201HF delivers:

• Consistent and tight solder deposits spread over multiple copies; excellent response-to-pause performance.
• Minimal voiding of tight pitch components, ensuring joint strength of small components
  Excellent reflow performance on components exhibiting high warpage.
• Improved drop performance with less coupling during the assembly process, improving yields for tight pitch components.
• Flexible cleaning can be used in processes that require cleaning with a saponifier or do not require cleaning.