Hyundai Motor Company has selected ST’s highly efficient ACEPACK DRIVE power module for several of its E-GMP vehicle platform models.
STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has released high-power modules for electric vehicles that increase the performance and range of driving. The ST’s new silicon-carbide (SiC) power modules were selected for Hyundai’s E-GMP electric-vehicle platform shared by the KIA EV6 and several other models.
Five new SiC-MOSFET based power modules provide flexible choices for vehicle manufacturers, covering a selection of power ratings and support for operating voltages commonly used in electric vehicle (EV) traction applications. Housed in ST’s ACEPACK DRIVE package optimized for traction applications, the power modules are reliable thanks to sintering technology, durable, and easy for manufacturers to integrate into EV drives. Internally, the leading power semiconductors are the third generation ST (Gen3) STPOWER SiC MOSFET STPOWER SiC MOSFET, which combines an industry-leading figure of merit (RDS(ON) x die area) with a very low switching energy and super performance in synchronous rectification.
“ST silicon carbide solutions enable major automotive OEMs to set the pace for electrification in the development of future generations of EVs,” said Marco Monti, President, Automotive and Discrete Group, STMicroelectronics. “Our third-generation SiC technology ensures maximum power density and energy efficiency, resulting in superior vehicle performance, range, and charging time.”
a leader in the automotive EV market, Hyundai Motor Company has selected ST’s ACEPACK DRIVE SiC-MOSFET Gen3 based power modules for its current generation EV platform, called E-GMP. In particular, the modules will power the Kia EV6. “ST’s SiC-MOSFET-based power modules are the right choice for our traction inverters, enabling a longer range. The cooperation between our two companies has realized an important step towards more sustainable electric vehicles, leveraging ST’s continued investment in technology to become a leading semiconductor actor in the electrification revolution,” said Mr. Sang-Cheol Shin, Inverter Engineering Design Team at Hyundai Motor Group.
As an industry leader in this technology, ST has supplied STPOWER SiC devices for more than three million mass-produced passenger cars worldwide. Compared to conventional silicon power semiconductors, small SiC devices can handle higher operating voltages allowing faster charging and better vehicle dynamics. Energy efficiency is also increased, which increases driving range, and reliability can be extended. SiC has gained mass adoption in many EV systems such as DC-DC converters, traction inverters, and on-board chargers (OBC) with bi-directional operation ready for vehicle-to-grid power transfer. ST’s SiC strategy, as an integrated device manufacturer (IDM), ensures quality and security of supply to serve carmakers’ strategies for electrification. With the recently announced fully integrated SiC substrate manufacturing facility in Catania, expected to start production in 2023, ST is moving quickly to support the market’s rapid transition to e-mobility.